One of the latest in high-density, surface-mount packages.
The package is similar to PGA. BGA pin connections are solder
balls in a grid pattern, in the package bottom.
MicroBGA: Same as BGA, except finer grids. There are
three prevalent Micro BGA pitches: 0.65, 0.75 and 0.8mm.
Interstitial BGA: (IBGA) This package type carries additional
pins, in a n offset pattern, in between the balls of a regular
BGA pattern. It almost doubles the available connections
on the same package size as a regular BGA.