IC test clips and IC Package adapters
adapters.com adapters.com
qfp adapters micro BGA ball grid array test clip
BGA adapters ic packages delta probe

To see our latest News Releases click here

BGA (Ball Grid Array)

PolyBGA Adapter for BGA

bga.gif (20172 bytes)
Description  
One of the latest in high-density, surface-mount packages.  The package is similar to PGA.  BGA pin connections are solder balls in a grid pattern, in the package bottom.

Package Variations
MicroBGA:  Same as BGA, except finer grids.  There are three prevalent Micro BGA pitches:  0.65, 0.75 and 0.8mm.

Interstitial BGA: (IBGA)  This package type carries additional pins, in a n offset pattern, in between the balls of a regular BGA pattern.  It almost doubles the available connections on the same package size as a regular BGA.

Critica Data
Pin Count
Lead Pitch -- Dimension P
Body Size -- Dimension B
Body Thickness -- Dimension F
Tip-to-Tip Dimension -- Dimension T
Foot Length -- Dimension L
Adatpers
BGA packages have only one type of adatper that can be used which is solder down.   This adapter has a base that is soldered down the same way an IC would be.   Then a break-out board goes on top to connect to your application.  One type of adapter is PolyBGA that can also be used as a socket.

 

custom adapter design gifCustom Adapter Design services are available. We specialize in providing custom solutions to your interconnect challenges.
IC test clips and IC package adapters adapters home
adapters