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DIP (Dual Inline Package)
dip.GIF (18641 bytes)
Description  
The most popular first generation IC package type. DIP is a thru-hole device with typical lead spacing of 0.100" on two sides of the package body. The body width varies: 0.300", 0.400", 0.600" and 0.900". Other hybrid types are still found. Today many DIP devices translate directly to SOIC or TSOP packages for higher density applications.

Package Variations
Shrink DIP (SDIP): Shrink DIP packages usually have higher pin counts (i.e., 48 or 64 lead). They have a lead pitch of 0.70" and a body size of either 0.600" or 0.750".

Critica Data
Pin Count
Body Width - Dimension W
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