The most popular first generation IC package type. DIP is a thru-hole
device with typical lead spacing of 0.100" on two sides of
the package body. The body width varies: 0.300", 0.400",
0.600" and 0.900". Other hybrid types are still found.
Today many DIP devices translate directly to SOIC or TSOP packages
for higher density applications.
Shrink DIP (SDIP): Shrink DIP packages usually have higher pin
counts (i.e., 48 or 64 lead). They have a lead pitch of 0.70"
and a body size of either 0.600" or 0.750".