Description
Second generation package. Still thru-hole, but the package
size is reduced by moving pins to the underside of the packages
in a grid pattern. The pins are located on a 0.1" grid
in various patterns. The grids is called out by the pins in
the x direction and the pins in the y direction.
Package Variations
Interstitial package(IPGA): type carries additional pins on a
0.5" offset pattern in between the pins of a regular PGA
pattern. It almost doubles the available pins on the same package
size as a standard PGA.
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