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To see our latest News Releases click here
SOIC
(Small Outline IC)
A.K.A. Gull Wing Package
A.K.A. Gull Wing Package
| Description The first surface-mount package to replace small pin count (i.e. 8-16) DIP packages. They are also called "Gull Wing" packages, referring to the shape of their pins. Lately, they are very popular for higher pin count (up to 64 pins), mostly memory types of ICs. At first packages with a 50mil (1.27mm) lead pitch dominated, but over the last few years various higher density versions became popular. These have acronyms such as SSOP, TSOP, TSSOP and so on, indicating features such as smaller (shrunk)pitch or thin package height. Package Variations |
| Critica Data Pin Count Pitch -- Dimension P Body Width -- Dimension B Body Thickness -- Dimension F Tip to Tip Dimension -- Dimension T |
Custom
Adapter Design services are available. We specialize in providing
custom solutions to your interconnect challenges. |
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