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TSOP (Thin Small Outline Package)


The TSOP is a special variation of the SOIC, because the different versions of body width.   Typically, "T" means a thin package.  This is a very critical dimension for products like the RoboClip.  Note the two different appearances of this package and the three acronyms.  The TSOP I has the pins on the WIDE edge.  The TSOP II has leads on NARROW side and looks more like a DIP package that was shrunk and turned into a surface mount package.

Package Variations
TSOP I -- Pitch 0.5 or 0.55mm
TSOP II -- Pitch: 0.65, 0.8 or 1.25mm
TSSOP -- Pitch: 0.4, 0.5 or 0.65mm

Critica Data
Pin Count
Pitch -- Dimension P
Body Width -- Dimension B
Body Thickness -- Dimension F
Tip to Tip Dimension -- Dimension T

*To order the RoboClip, you need to specify the distance from the bend in the lead on one side to the bend in the lead on the other side.

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