 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
||||||||||||||
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|
 |
 |
 |
 |
|
|||||||||||
 |
 |
 |
|
||||||||||||
To see our latest News Releases click here
TSOP
(Thin Small Outline Package)
| Description The TSOP is a special variation of the SOIC, because the different versions of body width. Typically, "T" means a thin package. This is a very critical dimension for products like the RoboClip. Note the two different appearances of this package and the three acronyms. The TSOP I has the pins on the WIDE edge. The TSOP II has leads on NARROW side and looks more like a DIP package that was shrunk and turned into a surface mount package. Package Variations |
| Critica Data Pin Count Pitch -- Dimension P Body Width -- Dimension B Body Thickness -- Dimension F Tip to Tip Dimension -- Dimension T *To order the RoboClip, you need to specify the distance from the bend in the lead on one side to the bend in the lead on the other side. |
TSOP II or TSSOP
TSOP I
Custom
Adapter Design services are available. We specialize in providing
custom solutions to your interconnect challenges. |
|
|
|
 |
|
||
 |
 |
 |
|
 |
|
||