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TSOP (Thin Small Outline Package)

 

Description  
The TSOP is a special variation of the SOIC, because the different versions of body width.   Typically, "T" means a thin package.  This is a very critical dimension for products like the RoboClip.  Note the two different appearances of this package and the three acronyms.  The TSOP I has the pins on the WIDE edge.  The TSOP II has leads on NARROW side and looks more like a DIP package that was shrunk and turned into a surface mount package.

Package Variations
TSOP I -- Pitch 0.5 or 0.55mm
TSOP II -- Pitch: 0.65, 0.8 or 1.25mm
TSSOP -- Pitch: 0.4, 0.5 or 0.65mm

Critica Data
Pin Count
Pitch -- Dimension P
Body Width -- Dimension B
Body Thickness -- Dimension F
Tip to Tip Dimension -- Dimension T

*To order the RoboClip, you need to specify the distance from the bend in the lead on one side to the bend in the lead on the other side.

TSOP II or TSSOP
tsop2.gif (20333 bytes)

TSOP I
tsop.gif (11500 bytes)

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